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| INTEGRATED CIRCUITS DATA SHEET TEA1207UK High efficiency DC/DC converter Chip Scale package Product specification 2002 Jul 03 Philips Semiconductors Product specification High efficiency DC/DC converter Chip Scale package FEATURES * Fully integrated DC/DC converter circuit * Up-or-down conversion * Start-up from 1.85 V input voltage * Adjustable output voltage * High efficiency over large load range * Power handling capability up to 0.85 A continuous average current * 275 kHz switching frequency * Low quiescent power consumption * Synchronizing with external clock * True current limit for Li-ion battery compatibility * Up to 100% duty cycle in down mode * Undervoltage lockout * Shut-down function * 2 x 2 mm footprint chip scale package. APPLICATIONS * Cellular and cordless phones, Personal Digital Assistants (PDAs) and others * Supply voltage source for low-voltage chip sets * Portable computers * Battery backup supplies * Cameras. ORDERING INFORMATION PACKAGE TYPE NUMBER NAME TEA1207UK LFBGA8 DESCRIPTION plastic low profile fine-pitch ball grid array package; 8 balls; body 2 x 2 x 0.46 mm GENERAL DESCRIPTION TEA1207UK The TEA1207UK is a fully integrated DC/DC converter. Efficient, compact and dynamic power conversion is achieved using a novel digitally controlled concept such as Pulse Width Modulation (PWM) or Pulse Frequency Modulation (PFM), integrated low RDSon CMOS power switches with low parasitic capacitances, and fully synchronous rectification. The device operates at a 275 kHz switching frequency which enables the use of external components with minimum size. Deadlock is prevented by an on-chip undervoltage lockout circuit. Efficient behaviour during short load peaks and compatibility with Li-ion batteries is guaranteed by an accurate current limiting function. VERSION - 2002 Jul 03 2 Philips Semiconductors Product specification High efficiency DC/DC converter Chip Scale package QUICK REFERENCE DATA SYMBOL Voltage levels UPCONVERSION; BALL U/D = LOW VI VO VI(start) VI VO GENERAL Vfb Iq Ishdwn ILX Ilim feedback voltage 1.19 input voltage output voltage start-up input voltage IL < 125 mA VI(start) - 2.80 1.40 - PARAMETER CONDITIONS MIN. TEA1207UK TYP. MAX. UNIT 5.50 5.50 1.85 V V V 1.60 - - 1.24 DOWNCONVERSION; BALL U/D = HIGH input voltage output voltage 2.80 1.30 5.50 5.50 V V 1.29 V A A A Current levels quiescent current on ball A1 current in shut-down state maximum continuous current on ball A2 current limiting deviation Tamb = 60 C Ilim = 0.5 to 5 A up mode down mode Power MOSFETs RDSon drain-to-source on-state resistance N-type P-type Efficiency 1 efficiency upconversion VI = 3.6 V; VO = 4.6 V; L1 = 10 H IL = 1 mA IL = 200 mA IL = 1 A; pulsed 2 efficiency downconversion VI = 3.6 V; VO = 2.0 V; L1 = 10 H IL = 1 mA IL = 200 mA IL = 1 A; pulsed Timing fsw fsync tres switching frequency synchronization clock input frequency response time from standby to Po(max) PWM mode 220 4 - 275 6.5 50 330 20 - kHz MHz s - - - 86 93 81 - - - % % % - - - 88 95 83 - - - % % % 0.10 0.10 0.20 0.22 0.30 0.35 -17.5 -17.5 - - +17.5 +17.5 % % down mode; VI = 3.6 V 52 - - 65 2 - 72 10 0.85 2002 Jul 03 3 This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in _white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ... dbook, full pagewidth 2002 Jul 03 LX A2 I/V CONVERTER ILIM C1 I/V CONVERTER CURRENT LIMIT COMPARATORS BLOCK DIAGRAM Philips Semiconductors High efficiency DC/DC converter Chip Scale package P-type POWER FET A1 UPOUT/DNIN sense FET START-UP CIRCUIT INTERNAL SUPPLY TEA1207UK CONTROL LOGIC AND MODE GEARBOX B2 FB 4 N-type POWER FET TEMPERATURE PROTECTION sense FET 13 MHz OSCILLATOR SYNC GATE TIME COUNTER DIGITAL CONTROLLER BAND GAP REFERENCE A3 B1 C3 C2 MGU402 GND SYNC SHDWN U/D TEA1207UK Product specification Fig.1 Block diagram. Philips Semiconductors Product specification High efficiency DC/DC converter Chip Scale package PINNING SYMBOL UPOUT/DNIN LX GND SYNC FB ILIM U/D SHDWN BALL A1 A2 A3 B1 B2 C1 C2 C3 DESCRIPTION output voltage in up mode; input voltage in down mode inductor connection ground synchronization clock input feedback input current limiting resistor connection up-or-down mode selection input; active LOW for up mode shut-down input TEA1207UK When high output power is requested, the device will operate in the PWM mode. This results in minimum AC currents in the circuit components and hence optimum efficiency, minimum cost and low EMC. In this operating mode, the output voltage is allowed to vary between two predefined voltage levels. As long as the output voltage stays within this so-called window, switching continues in a fixed pattern. When the output voltage reaches one of the window borders, the digital controller immediately reacts by adjusting the pulse width and inserting a current step in such a way that the output voltage stays within the window with higher or lower current capability. This approach enables very fast reaction to load variations. Figure 3 shows the converter's response to a sudden load increase. The upper trace shows the output voltage. The ripple on top of the DC level is a result of the current in the output capacitor, which changes in sign twice per cycle, times the capacitor's internal Equivalent Series Resistance (ESR). After each ramp-down of the inductor current, i.e. when the ESR effect increases the output voltage, the converter determines what to do in the next cycle. As soon as more load current is taken from the output the output voltage starts to decay. When the output voltage becomes lower than the low limit of the window, a corrective action is taken by a ramp-up of the inductor current during a much longer time. As a result, the DC current level is increased and normal PWM control can continue. The output voltage (including ESR effect) is again within the predefined window. Figure 4 shows the spread of the output voltage window. The absolute value is most dependent on spread, while the actual window size is not affected. For one specific device, the output voltage will not vary more than 2% typical. In low output power situations, the TEA1207UK will switch over to PFM mode. In this mode, regulation information from earlier PWM operating modes is used. This results in optimum inductor peak current levels in the PFM mode, which are slightly larger than the inductor ripple current in the PWM mode. As a result, the transition between PFM and PWM mode is optimum under all circumstances. In the PFM mode the TEA1207UK regulates the output voltage to the high window limit shown in Fig.3. handbook, halfpage C1 C2 C3 B1 B2 A1 A2 A3 MGU399 Fig.2 Ball configuration (bottom view). FUNCTIONAL DESCRIPTION Control mechanism The TEA1207UK is able to operate in PFM (discontinuous conduction) or PWM (continuous conduction) operating mode. All switching actions are completely determined by a digital control circuit which uses the output voltage level as its control input. This novel digital approach enables the use of a new pulse width and frequency modulation scheme, which ensures optimum power efficiency over the complete operating range of the converter. 2002 Jul 03 5 Philips Semiconductors Product specification High efficiency DC/DC converter Chip Scale package Synchronous rectification For optimum efficiency over the whole load range, synchronous rectifiers within the TEA1207UK ensure that during the whole second switching phase, all inductor current will flow through the low-ohmic power MOSFETs. Special circuitry is included which detects when the inductor current reaches zero. Following this detection, the digital controller switches off the power MOSFET and proceeds with regulation. Start-up Start-up from low input voltage in boost mode is realized by an independent start-up oscillator, which starts switching the N-type power MOSFET as soon as the voltage at ball UPOUT/DNIN is sufficiently high. The switch actions of the start-up oscillator will increase the output voltage. As soon as the output voltage is high enough for normal regulation, the digital control system takes over the control of the power MOSFETs. Undervoltage lockout As a result of too high load or disconnection of the input power source, the output voltage can drop so low that normal regulation cannot be guaranteed. In this event, the device switches back to start-up mode. If the output voltage drops down even further, switching is stopped completely. Shut-down When the shut-down input is made HIGH, the converter disables both power switches and the power consumption is reduced to a few microamperes. Power switches The power switches in the IC are one N-type and one P-type power MOSFET, having a typical drain-to-source resistance of 0.20 and 0.22 respectively. The maximum average current in the power switches is 0.60 A at Tamb = 80 C. Temperature protection When the device operates in the PWM mode, and the die temperature gets too high (typically 175 C), the converter stops operating. It resumes operation when the die temperature falls below 175 C again. As a result, low frequent cycling between the on and off state will occur. It should be noted that in the event of a device temperature around the cut-off limit, the application will differ strongly from the maximum specification. External synchronization Current limiters TEA1207UK If the current in one of the power switches exceeds its limit in the PWM mode, the current ramp is stopped immediately, and the next switching phase is entered. Current limiting is required to enable optimum use of energy in Li-ion batteries, and to keep power conversion efficient during temporary high loads. Furthermore, current limiting protects the IC against overload conditions, inductor saturation, etc. The current limiting level is set by an external resistor. If an external high frequency clock is applied to the synchronization clock input, the switching frequency in PWM mode will be exactly that frequency divided by 22. In PFM mode, the switching frequency is always lower. The quiescent current of the device increases when external clock pulses are applied. If no external synchronization is necessary, the synchronization clock input must be connected to ground. Behaviour when the input voltage exceeds the specified range In general, an input voltage exceeding the specified range is not recommended since instability may occur. There are two exceptions: * Upconversion: at an input voltage higher than the target output voltage, but up to 6 V, the converter will stop switching and the internal P-type power MOSFET will be conducting. The output voltage will equal the input voltage minus some resistive voltage drop. The current limiting function is not active. * Downconversion: when the input voltage is lower than the target output voltage, but higher than 2.8 V, the P-type power MOSFET will stay conducting resulting in an output voltage being equal to the input voltage minus some resistive voltage drop. The current limiting function remains active. 2002 Jul 03 6 Philips Semiconductors Product specification High efficiency DC/DC converter Chip Scale package TEA1207UK handbook, full pagewidth load increase Vo start corrective action high window limit low window limit time IL time MGK925 Fig.3 Response to load increase. handbook, full pagewidth maximum positive spread of Vfb Vh 2% +4% Vh Vout, typ 2% Vl -4% Vl upper specification limit Vh 2% typical situation Vl maximum negative spread of Vfb lower specification limit MGR667 Fig.4 Spread of location of output voltage window. 2002 Jul 03 7 Philips Semiconductors Product specification High efficiency DC/DC converter Chip Scale package LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL Vn Tj Tamb Tstg Ves PARAMETER voltage on any ball junction temperature ambient temperature storage temperature electrostatic handling voltage machine model; note 2 Notes 1. Class 3; equivalent to discharging a 100 pF capacitor through a 1500 resistor. CONDITIONS shut-down mode operating mode MIN. -0.2 -0.2 -25 -40 -40 human body model; note 1 -4000 -300 TEA1207UK MAX. +6.5 +5.9 +150 +80 +125 +4000 +300 V V UNIT C C C V V 2. Class 2; equivalent to discharging a 200 pF capacitor through a 10 resistor and a 0.75 H inductor. THERMAL CHARACTERISTICS SYMBOL Rth(j-a) Note 1. The thermal resistance is highly dependent on printed-circuit board type and metal routing. The value given is valid for a single metal layer printed-circuit board. QUALITY SPECIFICATION In accordance with "SNW-FQ-611 part E". PARAMETER thermal resistance from junction to Printed-Circuit Board (PCB) CONDITIONS in free air; note 1 VALUE 145 UNIT K/W 2002 Jul 03 8 Philips Semiconductors Product specification High efficiency DC/DC converter Chip Scale package TEA1207UK CHARACTERISTICS Tamb = -40 to +80 C; all voltages are measured with respect to ground; positive currents flow into the IC; unless otherwise specified. SYMBOL Voltage levels UPCONVERSION; BALL U/D = LOW Vi Vo Vi(start) Vi(uvlo) Vi Vo GENERAL Vfb Vwdw Iq Ishdwn ILX Ilim feedback input voltage output voltage window PWM mode 1.19 1.5 1.24 2.0 1.29 3.0 V % A A A A input voltage output voltage start-up input voltage undervoltage lockout input voltage IL < 125 mA note 1 VI(start) 2.80 1.40 1.50 - - 1.60 2.10 - - 5.50 5.50 1.85 2.50 V V V V PARAMETER CONDITIONS MIN. TYP. MAX. UNIT DOWNCONVERSION; BALL U/D = HIGH input voltage output voltage note 2 2.80 1.30 5.50 5.50 V V Current levels quiescent current on ball A1 current in shut-down mode maximum continuous current on ball A2 current limit deviation Tamb = 60 C Tamb = 80 C Ilim = 0.5 to 5.0 A; note 4 up mode down mode Power MOSFETs RDSon drain-to-source on-state resistance N-type P-type Efficiency 1 efficiency upconversion VI = 3.6 V; VO = 4.6 V; L1 = 10 H; note 5 IL = 1 mA IL = 10 mA IL = 50 mA IL = 100 mA IL = 200 mA IL = 500 mA IL = 1 A; pulsed - - - - - - - 88 93 93 94 95 92 83 - - - - - - - % % % % % % % 0.10 0.10 0.20 0.22 0.30 0.35 -17.5 -17.5 - - +17.5 +17.5 % % down mode; V3 = 3.0 V; note 3 52 - - - 65 2 - - 72 10 0.85 0.60 2002 Jul 03 9 Philips Semiconductors Product specification High efficiency DC/DC converter Chip Scale package SYMBOL 2 PARAMETER efficiency downconversion CONDITIONS VI = 3.6 V; VO = 2.0 V; L1 = 10 H; note 5 IL = 1 mA IL = 10 mA IL = 50 mA IL = 100 mA IL = 200 mA IL = 500 mA IL = 1 A; pulsed Timing fsw fsync tres Tamb Tco(max) VlL VIH switching frequency synchronization clock input frequency response time from standby to Po(max) PWM mode 220 4 - -40 150 275 6.5 50 - - - - - - - 86 91 92 92 93 89 81 MIN. TYP. TEA1207UK MAX. UNIT - - - - - - - 330 20 - +80 200 % % % % % % % kHz MHz s C C V Temperature ambient temperature maximum internal cut-off temperature +25 175 - Digital levels LOW-level input voltage on balls B1, C2 and C3 HIGH-level input voltage on ball C2 on balls B1 and C3 Notes 1. The undervoltage lockout voltage shows wide specification limits since it decreases at increasing temperature. When the temperature increases, the minimum supply voltage of the digital control part of the IC decreases and therefore the correct operation of this function is guaranteed over the whole temperature range. 2. When Vi is lower than the target output voltage but higher than 2.8 V, the P-type power MOSFET will remain conducting (100% duty cycle), resulting in Vo following Vi. 3. V3 is the voltage on ball A1 (UPOUT/DNIN). 4. The current limit is defined by the external resistor Rlim (see Section "Current limiting resistors"). Accuracy of the current limit increases in proportion to the programmed current limiting level. 5. The specified efficiency is valid when using an output capacitor having an ESR of 0.10 and a 10 H small size inductor (Coilcraft DT1608C-103). 6. If the applied HIGH-level voltage is less than V3 to 1 V, the quiescent current (lq) of the device will increase. note 6 V3 - 0.4 0.55V3 - - V3 + 0.3 V3 + 0.3 V V 0 0.4 2002 Jul 03 10 Philips Semiconductors Product specification High efficiency DC/DC converter Chip Scale package APPLICATION INFORMATION TEA1207UK handbook, full pagewidth D1 A1 L1 VI LX UPOUT/DNIN VO R1 A2 TEA1207UK B2 FB C2 R2 C1 C2 U/D A3 B1 C3 SHDWN C1 ILIM Rlim MGU400 GND SYNC Fig.5 Complete application diagram for upconversion. handbook, full pagewidth VI UPOUT/DNIN A1 A2 LX L1 VO TEA1207UK R1 B2 C1 C2 U/D C1 ILIM Rlim MGU401 FB C2 D1 R2 B1 SYNC A3 GND C3 SHDWN Fig.6 Complete application diagram for downconversion. 2002 Jul 03 11 Philips Semiconductors Product specification High efficiency DC/DC converter Chip Scale package External component selection INDUCTOR L1 The performance of the TEA1207UK is not very sensitive to inductance value. Best efficiency performance over a wide load current range is achieved by using e.g. TDK SLF7032-6R8M1R6, having an inductance of 6.8 H and a saturation current level of 1.6 A. In case the maximum output current is lower, other inductors are also suitable such as the small sized Coilcraft DT1608 range. INPUT CAPACITOR C1 The value of capacitor C1 strongly depends on the type of input source. In general, a 100 F tantalum capacitor will do, or a 10 F ceramic capacitor featuring very low series resistance (ESR value). OUTPUT CAPACITOR C2 The value and type of capacitor C2 depend on the maximum output current and the ripple voltage which is allowed in the application. Low-ESR tantalum capacitors show good results. The most important specification of capacitor C2 is its ESR, which mainly determines the output voltage ripple. DIODE D1 The Schottky diode is only used for a short time during takeover from N-type power MOSFET and P-type power MOSFET and vice versa. Therefore, a medium-power diode such as Philips PRLL5819 is sufficient. FEEDBACK RESISTORS R1 AND R2 The output voltage is determined by the resistors R1 and R2. The following conditions apply: CURRENT LIMITING RESISTORS TEA1207UK * Use 1% accurate SMD type resistors only. In case larger body resistors are used, the capacitance on ball B2 (feedback input) will be too large, causing inaccurate operation. * Resistors R1 and R2 should have a maximum value of 57 k when connected in parallel. A higher value will result in inaccurate operation. Under these conditions, the output voltage can be R1 calculated by the formula: V O = 1.24 x 1 + ------- R2 The maximum instantaneous current is set by the external resistors Rlim. The preferred type is SMD, 1% accurate. The connection of resistor Rlim differs per mode: * At upconversion (up mode): resistor Rlim must be connected between ball C1 (ILIM) and ball A1 (UPOUT/DNIN). The current limiting level is defined by: 238 I lim = --------R lim * At downconversion (down mode): resistor Rlim must be connected between ball C1 (ILIM) and ball A3 (GND). 270 The current limiting level is defined by: I lim = --------R lim The average inductor current during limited current operation also depends on the inductance value, input voltage, output voltage and resistive losses in all components in the power path. Ensure that Ilim < Isat saturation current of the inductor. 2002 Jul 03 12 Philips Semiconductors Product specification High efficiency DC/DC converter Chip Scale package PACKAGE OUTLINE TEA1207UK LFBGA8: plastic low profile fine-pitch ball grid array package; 8 balls; body 2.0 x 2.0 x 0.46 mm TEA1207 D B A ball A1 index area E A A2 A1 detail X b e ZD w M A vA y ZE C B e A 1 2 3 X 0 1 scale 2 mm DIMENSIONS (mm are the original dimensions) UNIT mm A max. 0.70 A1 0.28 0.20 A2 0.48 0.44 b 0.38 0.26 D 2.05 1.95 E 2.05 1.95 e 0.5 v 0.05 w 0.1 y 0.03 ZD 0.63 0.38 ZE 0.63 0.38 MSD746 OUTLINE VERSION TEA1207 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 2002 Jul 03 13 Philips Semiconductors Product specification High efficiency DC/DC converter Chip Scale package SOLDERING Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended. Reflow soldering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 to 250 C. The top-surface temperature of the packages should preferable be kept below 220 C for thick/large packages, and below 235 C for small/thin packages. Wave soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. TEA1207UK If wave soldering is used the following conditions must be observed for optimal results: * Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. * For packages with leads on two sides and a pitch (e): - larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; - smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. * For packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Manual soldering Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C. 2002 Jul 03 14 Philips Semiconductors Product specification High efficiency DC/DC converter Chip Scale package Suitability of surface mount IC packages for wave and reflow soldering methods PACKAGE(1) BGA, LBGA, LFBGA, SQFP, TFBGA, VFBGA HBCC, HBGA, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN, HVSON, SMS PLCC(4), SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO Notes not suitable not suitable(3) TEA1207UK SOLDERING METHOD WAVE REFLOW(2) suitable suitable suitable suitable suitable suitable not not recommended(4)(5) recommended(6) 1. For more detailed information on the BGA packages refer to the "(LF)BGA Application Note" (AN01026); order a copy from your Philips Semiconductors sales office. 2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods". 3. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, the solder might be deposited on the heatsink surface. 4. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 5. Wave soldering is suitable for LQFP, TQFP and QFP packages with a pitch (e) larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 6. Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. 2002 Jul 03 15 Philips Semiconductors Product specification High efficiency DC/DC converter Chip Scale package DATA SHEET STATUS DATA SHEET STATUS(1) Objective specification PRODUCT STATUS(2) Development DEFINITIONS TEA1207UK This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Changes will be communicated according to the Customer Product/Process Change Notification (CPCN) procedure SNW-SQ-650A. Preliminary specification Qualification Product specification Production Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. DEFINITIONS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. DISCLAIMERS Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. 2002 Jul 03 16 Philips Semiconductors Product specification High efficiency DC/DC converter Chip Scale package NOTES TEA1207UK 2002 Jul 03 17 Philips Semiconductors Product specification High efficiency DC/DC converter Chip Scale package NOTES TEA1207UK 2002 Jul 03 18 Philips Semiconductors Product specification High efficiency DC/DC converter Chip Scale package NOTES TEA1207UK 2002 Jul 03 19 Philips Semiconductors - a worldwide company Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com. (c) Koninklijke Philips Electronics N.V. 2002 SCA74 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 403502/02/pp20 Date of release: 2002 Jul 03 Document order number: 9397 750 08491 |
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